Chin-Sung Chung

According to our database, Chin-Sung Chung authored at least 1 paper in 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of seven.

2015

The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints.

Van Luong Nguyen, Chin-Sung Chung, Ho-Kyung Kim

Microelectron. Reliab., 2015