Chin-Li Kao

According to our database, Chin-Li Kao authored at least 8 papers between 2006 and 2018.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2018

Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes.

Chin-Li Kao, Tei-Chen Chen

Microelectron. Reliab., 2018

2016

Prediction of deformation during manufacturing processes of silicon interposer package with TSVs.

Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park

Microelectron. Reliab., 2016

2014

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.

Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu

Microelectron. Reliab., 2014

2010

Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package.

Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere

Microelectron. Reliab., 2010

2007

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.

Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu

Microelectron. Reliab., 2007

2006

Evaluation of board-level reliability of electronic packages under consecutive drops.

Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao

Microelectron. Reliab., 2006

Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages.

Yi-Shao Lai, Chin-Li Kao

Microelectron. Reliab., 2006

Characteristics of current crowding in flip-chip solder bumps.

Yi-Shao Lai, Chin-Li Kao

Microelectron. Reliab., 2006