Chin-Hung Wang

According to our database, Chin-Hung Wang authored at least 4 papers between 2009 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology.

Wei Lu, Jie Zhang, Yi-Hui Wei, Hsu-Ming Hsiao, Sih-Han Li, Chao-Kai Hsu, Chih-Cheng Hsiao, Feng-Hsiang Lo, Shyh-Shyuan Sheu, Chin-Hung Wang, Wei-Chung Lo, Shih-Chieh Chang, Hung-Ming Chen, Kuan-Neng Chen, Po-Tsang Huang

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2022

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.

Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2009

A DEP chip with arc-shape microelectrode arrays for the separation of different-size particles.

Cheng-Hsin Chuang, Yu-Chi Chen, You-Ming Hsu, Huei-Sheng Huang, Fei-Bin Hsiao, Chin-Hung Wang

Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009

An improvement of secure authentication scheme with full anonymity for wireless communications.

Chin-Hung Wang, Tzu-Chieh Wei, Po-Chin Lee, Chia-Chun Wu

Proceedings of the 2nd International Conference on Interaction Sciences: Information Technology, 2009