Chih Chen

According to our database, Chih Chen authored at least 7 papers between 2006 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2017

Growth competition between layer-type and porous-type Cu₃Sn in microbumps.

David T. Chu, Yi-Cheng Chu, Jie-An Lin, Yi-Ting Chen, Chun-Chieh Wang, Yen-Fang Song, Cheng-Cheng Chiang, Chih Chen, King-Ning Tu

Microelectron. Reliab., 2017

2013

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy.

King-Ning Tu, Hsiang-Yao Hsiao, Chih Chen

Microelectron. Reliab., 2013

Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps.

Y. W. Chang, H. Y. Peng, R. W. Yang, Chih Chen, T. C. Chang, Chau-Jie Zhan, Jin-Ye Juang, Annie T. Huang

Microelectron. Reliab., 2013

2012

The electromigration investigation of Cu-Ni nanocomposites.

Y. C. Chen, Chia Wei Chu, Tzu-Yuan Chao, Y. T. Cheng, Chih Chen

Proceedings of the 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2012

2009

Effect of bump size on current density and temperature distributions in flip-chip solder joints.

Wei-Chih Kuan, S. W. Liang, Chih Chen

Microelectron. Reliab., 2009

Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs.

Zhen-Ying Hsieh, Mu-Chun Wang, Chih Chen, Jia-Min Shieh, Yu-Ting Lin, Shuang-Yuan Chen, Heng-Sheng Huang

Microelectron. Reliab., 2009

2006

How the Perception of Project Success and Accountability Affect the IS process Document Completeness.

Te Wei, Chih Chen, Krishnamurthy Surysekar

Proceedings of the Connecting the Americas. 12th Americas Conference on Information Systems, 2006