Chih-Chao Yang

According to our database, Chih-Chao Yang authored at least 6 papers between 2014 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

3DIC with Stacked FinFET, Inter-Level Metal, and Field-Size (25×33mm²) Single-Crystalline Si on SiO2 by Elevated-Epi.

Bo-Jheng Shih, Yu-Ming Pan, Hao-Tung Chung, Chieh-Ling Lee, I-Chun Hsieh, Nein-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Hung-Ming Chen, Chiao-Yen Wang, Huan-Yu Chiu, Huang-Chung Cheng, Chang-Hong Shen, Wen-Fa Wu, Tuo-Hung Hou, Kuan-Neng Chen, Chenming Hu

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Bit-Cost-Scalable 3D DRAM Architecture and Unit Cell First Demonstrated with Integrated Gate-Around and Channel-Around IGZO FETs.

Feng-Min Lee, Po-Hao Tseng, Yu-Yu Lin, Yu-Hsuan Lin, Wei-Lun Weng, Nei-Chih Lin, Po-Jung Sung, Chien-Ting Wu, Chih-Chao Yang, Wen-Fa Wu, Chang-Hong Shen, Tuo-Hung Hou, Ming-Hsiu Lee, Kuang-Yeu Hsieh, Keh-Chung Wang, Chih-Yuan Lu

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2018

A Monolithic-3D SRAM Design with Enhanced Robustness and In-Memory Computation Support.

Srivatsa Rangachar Srinivasa, Akshay Krishna Ramanathan, Xueqing Li, Wei-Hao Chen, Fu-Kuo Hsueh, Chih-Chao Yang, Chang-Hong Shen, Jia-Min Shieh, Sumeet Kumar Gupta, Meng-Fan Marvin Chang, Swaroop Ghosh, Jack Sampson, Vijaykrishnan Narayanan

Proceedings of the International Symposium on Low Power Electronics and Design, 2018

2015

Low power algorithm-architecture co-design of fast Independent Component Analysis (FICA) for multi-gas sensor applications.

Chih-Chao Yang, Po-Tsang Huang, Chun-Ying Huang, Ching-Te Chuang, Wei Hwang

Proceedings of the VLSI Design, Automation and Test, 2015

Energy-efficient gas recognition system with event-driven power control.

Chun-Ying Huang, Po-Tsang Huang, Chih-Chao Yang, Ching-Te Chuang, Wei Hwang

Proceedings of the 28th IEEE International System-on-Chip Conference, 2015

2014

Electromigration challenges for advanced on-chip Cu interconnects.

Baozhen Li, Cathryn Christiansen, Dinesh Badami, Chih-Chao Yang

Microelectron. Reliab., 2014