Chenghu Dai
According to our database1,
Chenghu Dai
authored at least 15 papers
between 2023 and 2025.
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Bibliography
2025
Hybrid MOSFET-TFET 11T SRAM cell with high write speed and free half-selected disturbance.
Microelectron. J., 2025
2024
High-Performance Latch Designs of Double-Node-Upset Self-Recovery and Triple-Node-Upset Tolerance for Aerospace Applications.
IEEE Trans. Aerosp. Electron. Syst., October, 2024
IEEE Trans. Very Large Scale Integr. Syst., May, 2024
Soft-Error-Immune Quadruple-Node-Upset Tolerant Latch Based on Polarity Design and Source-Isolation Technologies.
IEEE Trans. Very Large Scale Integr. Syst., April, 2024
Flip Point Offset-Compensation Sense Amplifier With Sensing-Margin-Enhancement for Dynamic Random-Access Memory.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2024
A 9T-SRAM in-memory computing macro for Boolean logic and multiply-and-accumulate operations.
Microelectron. J., February, 2024
A CFMB STT-MRAM-Based Computing-in-Memory Proposal With Cascade Computing Unit for Edge AI Devices.
IEEE Trans. Circuits Syst. I Regul. Pap., January, 2024
Microelectron. J., 2024
Microelectron. J., 2024
A 28-nm 9T SRAM-based CIM macro with capacitance weighting module and redundant array-assisted ADC.
Microelectron. J., 2024
Corrigendum to "A 9T-SRAM based computing-in-memory with redundant unit and digital operation for boolean logic and MAC" [145, March 2024, 106124.
Microelectron. J., 2024
A 9T-SRAM based computing-in-memory with redundant unit and digital operation for boolean logic and MAC.
Microelectron. J., 2024
2023
Microelectron. J., February, 2023
Bit-line leakage current tracking and self-compensation circuit for SRAM reliability design.
Microelectron. J., February, 2023
IEICE Electron. Express, 2023