Cheng Pu Chiu
According to our database1,
Cheng Pu Chiu
authored at least 2 papers
in 2015.
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Bibliography
2015
Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node.
Proceedings of the IEEE International Reliability Physics Symposium, 2015
TDDB improvement of copper/dielectric in the highly-integrated BEOL structure for 28nm technology node and beyond.
Proceedings of the IEEE International Reliability Physics Symposium, 2015