Cheikh Diouf

According to our database1, Cheikh Diouf authored at least 9 papers between 2015 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

On csauthors.net:

Bibliography

2024
Non-conducting Hot carrier temperature activation and temperature sense effect.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023
Insight Into HCI Reliability on I/O Nitrided Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2021
HCI Temperature sense effect from 180nm to 28nm nodes.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020
Comparison of variability of HCI induced drift for SiON and HKMG devices.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Process Optimization for HCI Improvement in I/O Analog Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Investigation of NBTI Dynamic Behavior with Ultra-Fast Measurement.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
AC TDDB extensive study for an enlargement of its impact and benefit on circuit lifetime assessment.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

A new method for quickly evaluating reversible and permanent components of the BTI degradation.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015
Physical understanding of low frequency degradation of NMOS TDDB in High-k metal gate stack-based technology. Implication on lifetime assessment.
Proceedings of the IEEE International Reliability Physics Symposium, 2015


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