Che-Wei Chou

According to our database1, Che-Wei Chou authored at least 14 papers between 2010 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2024
DeepMachining: Online Prediction of Machining Errors of Lathe Machines.
CoRR, 2024

2017
An empirical study of bio manufacturing for the scheduling of hepatitis in vitro diagnostic device with constrained process time window.
Comput. Ind. Eng., 2017

Autonomous Deployment of UAVs as Access Points to Serve Wireless Terminals.
Proceedings of the 86th IEEE Vehicular Technology Conference, 2017

2016
A Novel Route Selection and Resource Allocation Approach to Improve the Efficiency of Manual Material Handling System in 200-mm Wafer Fabs for Industry 3.5.
IEEE Trans Autom. Sci. Eng., 2016

2015
Hierarchical Test Integration Methodology for 3-D ICs.
IEEE Des. Test, 2015

Testing Inter-Word Coupling Faults of Wide I/O DRAMs.
Proceedings of the 24th IEEE Asian Test Symposium, 2015

2014
A Multiobjective Hybrid Genetic Algorithm for TFT-LCD Module Assembly Scheduling.
IEEE Trans Autom. Sci. Eng., 2014

2013
A Built-In Self-Repair Scheme for 3-D RAMs With Interdie Redundancy.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013

A TSV Repair Scheme Using Enhanced Test Access Architecture for 3-D ICs.
Proceedings of the 22nd Asian Test Symposium, 2013

2012
Post-bond test techniques for TSVs with crosstalk faults in 3D ICs.
Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, 2012

A built-in self-test scheme for 3D RAMs.
Proceedings of the 2012 IEEE International Test Conference, 2012

2010
A low-cost built-in self-test scheme for an array of memories.
Proceedings of the 15th European Test Symposium, 2010

Test and Repair Scheduling for Built-In Self-Repair RAMs in SOCs.
Proceedings of the Fifth IEEE International Symposium on Electronic Design, 2010

A Test Integration Methodology for 3D Integrated Circuits.
Proceedings of the 19th IEEE Asian Test Symposium, 2010


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