Chau-Jie Zhan

According to our database, Chau-Jie Zhan authored at least 3 papers between 2008 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps.

Y. W. Chang, H. Y. Peng, R. W. Yang, Chih Chen, T. C. Chang, Chau-Jie Zhan, Jin-Ye Juang, Annie T. Huang

Microelectron. Reliab., 2013

Performance and process characteristic of glass interposer with through-glass-via(TGV).

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2008

Influence of underfill materials on the reliability of coreless flip chip package.

Chun-Chih Chuang, Tsung-Fu Yang, Jin-Ye Juang, Yin-Po Hung, Chau-Jie Zhan, Yu-Min Lin, Ching-Tsung Lin, Pei-Chen Chang, Tao-Chih Chang

Microelectron. Reliab., 2008