Chase Cook

According to our database, Chase Cook authored at least 14 papers between 2016 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution.

Xiaoyi Wang, Shaobin Ma, Sheldon X.-D. Tan, Chase Cook, Liang Chen, Jianlei Yang, Wenjian Yu

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021

2019

Simulation for Reliability, Hardware Security, and Ising Computing in VLSI Chip Design.

Chase Cook

PhD thesis, 2019

GPU-based Ising computing for solving max-cut combinatorial optimization problems.

Chase Cook, Hengyang Zhao, Takashi Sato, Masayuki Hiromoto, Sheldon X.-D. Tan

Integr., 2019

Reliability based hardware Trojan design using physics-based electromigration models.

Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan

Integr., 2019

GPU-based Ising Computing for Solving Balanced Min-Cut Graph Partitioning Problem.

Chase Cook, Wentian Jin, Sheldon X.-D. Tan

CoRR, 2019

2018

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method.

Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan

IEEE Trans. Very Large Scale Integr. Syst., 2018

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires.

Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018

Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited).

Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel

Integr., 2018

Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy.

Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun

Integr., 2018

Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires.

Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan

Proceedings of the 15th International Conference on Synthesis, 2018

2017

Fast physics-based electromigration analysis for multi-branch interconnect trees.

Xiaoyi Wang, Yan Yan, Jian He, Sheldon X.-D. Tan, Chase Cook, Shengqi Yang

Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

2016

Finite difference method for electromigration analysis of multi-branch interconnects.

Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan

Proceedings of the 13th International Conference on Synthesis, 2016

Dynamic reliability management for near-threshold dark silicon processors.

Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Invited - Cross-layer modeling and optimization for electromigration induced reliability.

Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan

Proceedings of the 53rd Annual Design Automation Conference, 2016