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Chao-Yang Mao

According to our database1, Chao-Yang Mao authored at least 2 papers between 2008 and 2015.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

Legend:

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In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2015
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls.
[BibTeX]
[DOI]
Hsin-En Cheng
,
Rong-Sheng Chen
,
Chao-Yang Mao
Qual. Reliab. Eng. Int., 2015

2008
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint.
[BibTeX]
[DOI]
Chao-Yang Mao
,
Rong-Sheng Chen
Microelectron. Reliab., 2008


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