Chao-Kun Hu

According to our database, Chao-Kun Hu authored at least 3 papers between 1995 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Future on-chip interconnect metallization and electromigration.

Chao-Kun Hu, James J. Kelly, Huai Huang, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2006

Electromigration of Cu/low dielectric constant interconnects.

Chao-Kun Hu, Lynne M. Gignac, R. Rosenberg

Microelectron. Reliab., 2006

1995

Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines.

Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin

IBM J. Res. Dev., 1995