Changming Cui

According to our database, Changming Cui authored at least 2 papers between 2021 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Physical-aware Interconnect Testing and Repairing of Chiplets.

Changming Cui, Tuanhui Xu, Haitao Fu, Junlin Huang

Proceedings of the IEEE European Test Symposium, 2023

2021

A 3DIC interconnect interface test and repair scheme based on Hybrid IEEE1838 Die Wrapper Register and BIST circuit.

Changming Cui, Junlin Huang

Proceedings of the 26th IEEE European Test Symposium, 2021