Chang-Chun Lee
Orcid: 0000-0002-4278-6510
According to our database1,
Chang-Chun Lee
authored at least 11 papers
between 2006 and 2023.
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Bibliography
2023
Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
2022
2018
Effect of contact-etch-stop-layer and Si<sub>1-x</sub>Ge<sub>x</sub> channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays.
Microelectron. Reliab., 2018
2015
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology.
Microelectron. Reliab., 2015
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology.
Microelectron. Reliab., 2015
2012
Light degradation test and design of thermal performance for high-power light-emitting diodes.
Microelectron. Reliab., 2012
2011
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test.
Microelectron. Reliab., 2011
2007
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.
Microelectron. Reliab., 2007
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure.
Microelectron. Reliab., 2007
2006
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect.
Microelectron. Reliab., 2006