Chan Qiu

Orcid: 0000-0003-0393-2199

According to our database1, Chan Qiu authored at least 14 papers between 2015 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Subspace Metric-Based Transfer Learning for Spindle Thermal Error Prediction Under Time-Varying Conditions.
IEEE Trans. Instrum. Meas., 2024

A blockchain-based smart contract model for secured energy trading management in smart microgrids.
Secur. Priv., 2024

A high-precision T-spline blade modeling method with 2D and 3D knot adaptive refinement.
Adv. Eng. Softw., 2024

2021
Accurate on-line support vector regression incorporated with compensated prior knowledge.
Neural Comput. Appl., 2021

On stability and convergence of suboptimal estimation for systems over lossy networks without acknowledgement.
Int. J. Syst. Sci., 2021

2019
Digital assembly technology based on augmented reality and digital twins: a review.
Virtual Real. Intell. Hardw., 2019

A novel support vector regression algorithm incorporated with prior knowledge and error compensation for small datasets.
Neural Comput. Appl., 2019

Isogeometric analysis of large thin shell structures based on weak coupling of substructures with unstructured T-splines patches.
Adv. Eng. Softw., 2019

Sensitivity Analysis of Random and Interval Uncertain Variables Based on Polynomial Chaos Expansion Method.
IEEE Access, 2019

2018
Assembly variation analysis of flexible curved surfaces based on Bézier curves.
Frontiers Inf. Technol. Electron. Eng., 2018

Generalized pseudo-Bayesian estimator for networked control systems over UDP-like channels.
J. Frankl. Inst., 2018

A real-time interactive system of surface reconstruction and dynamic projection mapping with RGB-depth sensor and projector.
Int. J. Distributed Sens. Networks, 2018

A Non-Ideal Geometry Based Prediction Approach of Fitting Performance and Leakage Characteristic of Precision Couplings.
IEEE Access, 2018

2015
Realistic Geometry Based Feature Modeling of Complex Part and Its Application in Assembly Quality Analysis.
J. Comput. Inf. Sci. Eng., 2015


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