Cha-Hsin Lin

According to our database, Cha-Hsin Lin authored at least 2 papers in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

A High Layer Scalability TSV-Based 3D-SRAM With Semi-Master-Slave Structure and Self-Timed Differential-TSV for High-Performance Universal-Memory-Capacity-Platforms.

Meng-Fan Chang, Chih-Sheng Lin, Wei-Cheng Wu, Ming-Pin Chen, Yen-Huei Chen, Zhe-Hui Lin, Shyh-Shyuan Sheu, Tzu-Kun Ku, Cha-Hsin Lin, Hiroyuki Yamauchi

IEEE J. Solid State Circuits, June, 2013

Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer.

Jui-Chin Chen, John H. Lau, Tzu-Chien Hsu, Chien-Chou Chen, Pei-Jer Tzeng, Po-Chih Chang, Chun-Hsien Chien, Yiu-Hsiang Chang, Shang-Chun Chen, Yu-Chen Hsin, Sue-Chen Liao, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013