Cédrick Chappaz

According to our database¹, Cédrick Chappaz authored at least 7 papers between 2007 and 2017.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

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Bibliography

2017

Friction Reduction through Ultrasonic Vibration Part 2: Experimental Evaluation of Intermittent Contact and Squeeze Film Levitation.

[BibT_eX]

[DOI]

IEEE Trans. Haptics, 2017

2016

Psychophysical Power Optimization of Friction Modulation for Tactile Interfaces.

[BibT_eX]

[DOI]

Proceedings of the Haptics: Perception, Devices, Control, and Applications, 2016

2015

Experimental evaluation of friction reduction in ultrasonic devices.

[BibT_eX]

[DOI]

Proceedings of the 2015 IEEE World Haptics Conference, 2015

Stress management strategy to limit die curvature during silicon interposer integration.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2013

2011

200°C direct bonding copper interconnects : Electrical results and reliability.

[BibT_eX]

[DOI]

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2007

Development of Embedded Three-Dimensional 35-nF/mm<sup>2</sup> MIM Capacitor and BiCMOS Circuits Characterization.

[BibT_eX]

[DOI]

Jean-Christophe Giraudin

IEEE J. Solid State Circuits, 2007

Cédrick Chappaz

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