Cédric Bermond

According to our database, Cédric Bermond authored at least 6 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

A Microwave Frequency Range Experiment for the Measurement of Snow Density and Liquid Water Content.

Cédric Bermond, Philippe Artillan, Michel Gay

IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2021

In-situ characterization up to 100 ​GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies.

Gregory Houzet, Thierry Lacrevaz, Cédric Bermond, Philippe Artillan, David Auchère, Laurent Schwarz, Bernard Fléchet

Microelectron. J., 2021

2014

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer.

Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits.

Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2009

Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking.

Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Françis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.

Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009