Carlos Mazure

According to our database, Carlos Mazure authored at least 5 papers between 2001 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

3D monolithic integration: Stacking technology and applications.

Ionut Radu, Bich-Yen Nguyen, Gweltaz Gaudin, Carlos Mazure

Proceedings of the 2015 International Conference on IC Design & Technology, 2015

2013

Novel low temperature 3D wafer stacking technology for high density device integration.

Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu

Proceedings of the European Solid-State Device Research Conference, 2013

2010

FDSOI: From substrate to devices and circuit applications.

Carlos Mazure, Richard Ferrant, Bich-Yen Nguyen, Walter Schwarzenbach, Cécile Moulin

Proceedings of the 36th European Solid-State Circuits Conference, 2010

2005

Engineering wafers for the nanotechnology era.

Carlos Mazure, Andre-Jacques Auberton-Herve

Proceedings of the 31st European Solid-State Circuits Conference, 2005

2001

FeRAM technology for high density applications.

Thomas Mikolajick, Christine Dehm, Walter Hartner, Ivan Kasko, Marcus J. Kastner, Nicolas Nagel, Manfred Moert, Carlos Mazure

Microelectron. Reliab., 2001