Carl V. Thompson

According to our database, Carl V. Thompson authored at least 11 papers between 1999 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.

Wardhana A. Sasangka, Yu Gao, Chee Lip Gan, Carl V. Thompson

Microelectron. Reliab., 2018

2017

Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation.

Wardhana A. Sasangka, Govindo J. Syaranamual, Y. Gao, Riko I. Made, Chee Lip Gan, Carl V. Thompson

Microelectron. Reliab., 2017

Characterisation of defects generated during constant current InGaN-on-silicon LED operation.

Riko I. Made, Yu Gao, Govindo J. Syaranamual, Wardhana A. Sasangka, L. Zhang, Xuan Sang Nguyen, Y. Y. Tay, Jason Scott Herrin, Carl V. Thompson, Chee Lip Gan

Microelectron. Reliab., 2017

2016

Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation.

Govindo J. Syaranamual, Wardhana A. Sasangka, Riko I. Made, Subramaniam Arulkumaran, Geok Ing Ng, Siew Chuen Foo, Chee Lip Gan, Carl V. Thompson

Microelectron. Reliab., 2016

2015

Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing.

Wardhana A. Sasangka, Govindo J. Syaranamual, Chee Lip Gan, Carl V. Thompson

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2007

Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.

Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel

Microelectron. J., 2007

2005

Electromigration Reliability Comparison of Cu and Al Interconnects.

Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel

Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005

Thermal aware cell-based full-chip electromigration reliability analysis.

Syed M. Alam, Donald E. Troxel, Carl V. Thompson

Proceedings of the 15th ACM Great Lakes Symposium on VLSI 2005, 2005

2004

Circuit Level Reliability Analysis of Cu Interconnects.

Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel

Proceedings of the 5th International Symposium on Quality of Electronic Design (ISQED 2004), 2004

2002

A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits.

Syed M. Alam, Donald E. Troxel, Carl V. Thompson

Proceedings of the 3rd International Symposium on Quality of Electronic Design, 2002

1999

Methodology for electromigration critical threshold design rule evaluation.

J. Joseph Clement, Stefan P. Riege, Radenko Cvijetic, Carl V. Thompson

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1999