C. S. Selvanayagam

According to our database, C. S. Selvanayagam authored at least 3 papers between 2008 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Constitutive modeling of solder alloys for drop-impact applications.

Ee-Hua Wong, J. Chrisp, C. S. Selvanayagam, S. K. W. Seah

Microelectron. Reliab., 2016

2011

A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications.

Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2008

Correlation studies for component level ball impact shear test and board level drop test.

Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh

Microelectron. Reliab., 2008