C. Ferrandon

According to our database, C. Ferrandon authored at least 2 papers in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications.

Y. Lamy, Laurent Dussopt, Ossama El Bouayadi, C. Ferrandon, Alexandre Siligaris, Cedric Dehos, Pierre Vincent

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013