C. Connor
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Bibliography
2024
Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
An Intel 3 Advanced FinFET Platform Technology for High Performance Computing and SOC Product Applications.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024