C. Bohm

According to our database, C. Bohm authored at least 3 papers between 1993 and 2010.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2010

Prediction of cure induced warpage of micro-electronic products.

Jan de Vreugd, Kaspar M. B. Jansen, Leo J. Ernst, C. Bohm

Microelectron. Reliab., 2010

2009

Modeling and characterization of molding compound properties during cure.

Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, Harald Preu, Matthias Stecher

Microelectron. Reliab., 2009

1993

System Level Policies for Fault Tolerance Issues in the FERMI Project.

A. Dell'Acqua, M. Hansen, Sami J. Inkinen, B. Lofstedt, J. P. Vanuxem, Christer Svensson, Jiren Yuan, H. Hentzell, L. Del Buono, J. David, J. F. Genat, H. Lebbolo, O. LeDortz, P. Nayman, Aurore Savoy-Navarro, R. Zitoun, Cesare Alippi, Luca Breveglieri, Luigi Dadda, Vincenzo Piuri, Fabio Salice, Mariagiovanna Sami, Renato Stefanelli, P. Cattaneo, G. Fumagalli, G. Goggi, Simona Brigati, Umberto Gatti, Franco Maloberti, Guido Torelli, P. Carlson, A. Kerek, Goran Appelquist, S. Berglund, C. Bohm, Magnus Engström, N. Yamdagni, Rolf Sundblad, I. Höglund, S. T. Persson

Proceedings of the IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems, 1993