Byung-Hyun Kwak

According to our database, Byung-Hyun Kwak authored at least 2 papers in 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2011

Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices.

Myeong-Hyeok Jeong, Jae-Won Kim, Byung-Hyun Kwak, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo

Proceedings of the BIODEVICES 2011, 2011

Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration.

Byung-Hyun Kwak, Sung-Hyuk Kim, Young-Bae Park

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011