Bumhee Bae

According to our database, Bumhee Bae authored at least 6 papers between 2013 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Proposal of Flat-coaxial Cable Structure and its Design Methodology based on FPCB process for 5G application.

Bumhee Bae, Younho Kim, Minseok Kim, Youngkun Kwon, Jeongnam Cheon

Proceedings of the IEEE International Conference on Consumer Electronics, 2019

2017

Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems.

Sung Joo Park, Bumhee Bae, Joungho Kim, Madhavan Swaminathan

IEEE Trans. Very Large Scale Integr. Syst., 2017

2014

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.

Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment.

Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013