Brian Philofsky

According to our database, Brian Philofsky authored at least 2 papers in 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications.

Gamal Refai-Ahmed, Ivor Barber, Anthony Torza, Brian Philofsky

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Best engineering practice for thermal characterization of stacked dice FPGA devices.

Arun Raghupathy, Hoa Do, Brian Philofsky, Gamal Refai-Ahmed

Proceedings of the 2015 International 3D Systems Integration Conference, 2015