Brian Mattis

According to our database, Brian Mattis authored at least 3 papers between 2008 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Front-side mid-level Tungsten TSV integration for high-density 3D applications.

Brian Mattis, Lovelace Soirez, Catherine Bullock, Dave Martini, Sara Jensen, James Levy, Adam Jones

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

High density backside tungsten TSV for 3D stacked ICs.

Reynard Blasa, Brian Mattis, Dave Martini, Sidi Lanee, Carl Petteway, Sangki Hong, Kangsoo Yi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2008

Printed electronics for low-cost electronic systems: Technology status and application development.

Vivek Subramanian, Josephine B. Chang, Alejandro de la Fuente Vornbrock, Daniel C. Huang, Lakshmi Jagannathan, Frank Liao, Brian Mattis, Steven E. Molesa, David R. Redinger, Daniel Soltman, Steven K. Volkman, Qintao Zhang

Proceedings of the ESSCIRC 2008, 2008