Brent Goplen

According to our database, Brent Goplen authored at least 8 papers between 2003 and 2007.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2007

Placement of 3D ICs with Thermal and Interlayer Via Considerations.

Brent Goplen, Sachin S. Sapatnekar

Proceedings of the 44th Design Automation Conference, 2007

2006

Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives.

Brent Goplen, Sachin S. Sapatnekar

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2006

Temperature-Aware Placement for SOCs.

Jeng-Liang Tsai, Charlie Chung-Ping Chen, Guoqiang Chen, Brent Goplen, Haifeng Qian, Yong Zhan, Sung-Mo Kang, Martin D. F. Wong, Sachin S. Sapatnekar

Proc. IEEE, 2006

Electrothermal analysis and optimization techniques for nanoscale integrated circuits.

Yong Zhan, Brent Goplen, Sachin S. Sapatnekar

Proceedings of the 2006 Conference on Asia South Pacific Design Automation: ASP-DAC 2006, 2006

2005

Placement and Routing in 3D Integrated Circuits.

Cristinel Ababei, Yan Feng, Brent Goplen, Hushrav Mogal, Tianpei Zhang, Kia Bazargan, Sachin S. Sapatnekar

IEEE Des. Test Comput., 2005

Thermal via placement in 3D ICs.

Brent Goplen, Sachin S. Sapatnekar

Proceedings of the 2005 International Symposium on Physical Design, 2005

Net weighting to reduce repeater counts during placement.

Brent Goplen, Prashant Saxena, Sachin S. Sapatnekar

Proceedings of the 42nd Design Automation Conference, 2005

2003

Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach.

Brent Goplen, Sachin S. Sapatnekar

Proceedings of the 2003 International Conference on Computer-Aided Design, 2003