Brendan Farley

According to our database, Brendan Farley authored at least 14 papers between 2013 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Software Abstraction of Next Generation Radio Access Networks.

Brendan Farley

Proceedings of the 49th IEEE European Solid State Circuits Conference, 2023

2019

A 1-V Bandgap Reference in 7-nm FinFET With a Programmable Temperature Coefficient and Inaccuracy of ±0.2% From -45°C to 125°C.

Umanath Kamath, Edward Cullen, Tao Yu, John Jennings, Susan Wu, Peng Lim, Brendan Farley, Robert Bogdan Staszewski

IEEE J. Solid State Circuits, 2019

2018

An All-Programmable 16-nm RFSoC for Digital-RF Communications.

Brendan Farley, John McGrath, Christophe Erdmann

IEEE Micro, 2018

A 13Bit 5GS/S ADC with Time-Interleaved Chopping Calibration in 16NM FinFET.

Bruno Vaz, Bob Verbruggen, Christophe Erdmann, Diarmuid Collins, John McGrath, Ali Boumaalif, Edward Cullen, Darragh Walsh, Alonso Morgado, Conrado Mesadri, Brian Long, Rajitha Pathepuram, Ronnie De La Torre, Alvin Manlapat, Georgios Karyotis, Dimitris Tsaliagos, Patrick Lynch, Peng Lim, Daire Breathnach, Brendan Farley

Proceedings of the 2018 IEEE Symposium on VLSI Circuits, 2018

A modular 16NM Direct-RF TX/RX Embedding 9GS/S DAC and 4.5GS/S ADC with 90DB Isolation and Sub-80PS Channel Alignment for Monolithic Integration in 5G Base-Station SoC.

Christophe Erdmann, Bob Verbruggen, Bruno Vaz, Roberto Pelliconi, John McGrath, Ryan Kinnerk, Ronnie De La Torre, John O'Dwyer, Patrick Lynch, Padraig Kelly, Peng Lim, Daire Breathnach, Brendan Farley

Proceedings of the 2018 IEEE Symposium on VLSI Circuits, 2018

A 7.4-to-14GHz PLL with 54fsrms jitter in 16nm FinFET for integrated RF-data-converter SoCs.

Didem Turker, Ade Bekele, Parag Upadhyaya, Bob Verbruggen, Ying Cao, Shaojun Ma, Christophe Erdmann, Brendan Farley, Yohan Frans, Ken Chang

Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

BJT Device and Circuit Co-Optimization Enabling Bandgap Reference and Temperature Sensing in 7-nm FinFET.

Umanath Kamath, Tao Yu, Wei Yao, Edward Cullen, John Jennings, Susan Wu, Peng Lim, Brendan Farley, Robert Bogdan Staszewski

Proceedings of the 48th European Solid-State Device Research Conference, 2018

A 1 V Bandgap Reference in 7-nm FinFET with a Programmable Temperature Coefficient and an Inaccuracy of ±0.2% from -45°C to 125°C.

Umanath Kamath, Edward Cullen, John Jennings, Ionut Cical, Darragh Walsh, Peng Lim, Brendan Farley, Robert Bogdan Staszewski

Proceedings of the 44th IEEE European Solid State Circuits Conference, 2018

2017

16.1 A 13b 4GS/s digitally assisted dynamic 3-stage asynchronous pipelined-SAR ADC.

Bruno Vaz, Adrian Lynam, Bob Verbruggen, Asma Laraba, Conrado Mesadri, Ali Boumaalif, John McGrath, Umanath Kamath, Ronnie De La Torre, Alvin Manlapat, Daire Breathnach, Christophe Erdmann, Brendan Farley

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

16.3 A 330mW 14b 6.8GS/s dual-mode RF DAC in 16nm FinFET achieving -70.8dBc ACPR in a 20MHz channel at 5.2GHz.

Christophe Erdmann, Edward Cullen, Damien Brouard, Roberto Pelliconi, Bob Verbruggen, John McGrath, Diarmuid Collins, Marites De La Torre, Pierrick Gay, Patrick Lynch, Peng Lim, Anthony Collins, Brendan Farley

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

A programmable RFSoC in 16nm FinFET technology for wideband communications.

Brendan Farley, Christophe Erdmann, Bruno Vaz, John McGrath, Edward Cullen, Bob Verbruggen, Roberto Pelliconi, Daire Breathnach, Peng Lim, Ali Boumaalif, Patrick Lynch, Conrado Mesadri, David Melinn, Kwee Peng Yap, Liam Madden

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2017

2015

A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters.

Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden

IEEE J. Solid State Circuits, 2015

2014

6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters.

Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

2013

Panel: "will 3D-IC remain a technology of the future... even in the future?".

Marco Casale-Rossi, Patrick Leduc, Giovanni De Micheli, Patrick Blouet, Brendan Farley, Anna Fontanelli, Dragomir Milojevic, Steve Smith

Proceedings of the Design, Automation and Test in Europe, 2013