Boris Vaisband

Orcid: 0000-0002-6176-5918

According to our database1, Boris Vaisband authored at least 25 papers between 2014 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2024
Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms.
Proceedings of the Great Lakes Symposium on VLSI 2024, 2024

2023
A Robust Integrated Power Delivery Methodology for 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst., March, 2023

CTT-Based Scalable Neuromorphic Architecture.
IEEE J. Emerg. Sel. Topics Circuits Syst., March, 2023

P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs.
Proceedings of the 36th IEEE International System-on-Chip Conference, 2023

Digital LIF Neuron for CTT-Based Neuromorphic Systems.
Proceedings of the Great Lakes Symposium on VLSI 2023, 2023

Statistical Weight Refresh System for CTT-Based Synaptic Arrays.
Proceedings of the Great Lakes Symposium on VLSI 2023, 2023

Hybrid Obfuscation of Chiplet-Based Systems.
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023

2022
A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source.
IEEE Access, 2022

Integrated Power Delivery Methodology for 3D ICs.
Proceedings of the 23rd International Symposium on Quality Electronic Design, 2022

Power Delivery for Ultra-Large-Scale Applications on Si-IF.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2022

2021
Power Delivery for Silicon Interconnect Fabric.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2021

2020
Multi-Bit CNT TSV for 3-D ICs.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2020

2019
Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems.
IBM J. Res. Dev., 2019

Communication Considerations for Silicon Interconnect Fabric.
Proceedings of the 21st ACM/IEEE International Workshop on System Level Interconnect Prediction, 2019

Global and semi-global communication on Si-IF.
Proceedings of the 13th IEEE/ACM International Symposium on Networks-on-Chip, 2019

Reliability Evaluation of Silicon Interconnect Fabric Technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems.
Future Gener. Comput. Syst., 2018

Network on interconnect fabric.
Proceedings of the 19th International Symposium on Quality Electronic Design, 2018

2017
Hexagonal TSV Bundle Topology for 3-D ICs.
IEEE Trans. Circuits Syst. II Express Briefs, 2017

Hybrid energy harvesting in 3-D IC IoT devices.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2017

2016
Noise Coupling Models in Heterogeneous 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst., 2016

Layer ordering to minimize TSVs in heterogeneous 3-D ICs.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2016

2015
Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits.
IEEE Trans. Very Large Scale Integr. Syst., 2015

3-D floorplanning algorithm to minimize thermal interactions.
Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015

2014
Thermal conduction path analysis in 3-D ICs.
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014


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