Boonhwa Yee

According to our database, Boonhwa Yee authored at least 1 paper in 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination.

Lois Jinzhi Liao, Xi Zhang, Xiaomin Li, Younan Hua, Chao Fu, Weikok Tee, Boonhwa Yee, Bisheng Wang, Songlin Mao

Proceedings of the International Conference on IC Design and Technology, 2019