Bongtae Han

According to our database, Bongtae Han authored at least 12 papers between 2005 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2022

Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach.

Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Guo Qi Zhang

IEEE Trans. Ind. Electron., 2022

2017

Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method.

Hsiu-Ping Wei, Bongtae Han, Byeng Dong Youn, Hyuk Shin, Ilho Kim, Hojeong Moon

Microelectron. Reliab., 2017

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor.

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Jakub Gromala, Bongtae Han, Dirk Mayer, Tobias Melz

Microelectron. Reliab., 2017

2016

In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor.

Alicja Palczynska, Przemyslaw Jakub Gromala, Dirk Mayer, Bongtae Han, Tobias Melz

Microelectron. Reliab., 2016

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages.

Kenny Mahan, Byung Kim, Bulong Wu, Bongtae Han, Ilho Kim, Hojeong Moon, Young Nam Hwang

Microelectron. Reliab., 2016

2014

Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire.

Dae-Suk Kim, Bongtae Han, Youn-Jea Kim

Microelectron. Reliab., 2014

2013

Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability.

Bong-Min Song, Bongtae Han, Joon-Hyun Lee

Microelectron. Reliab., 2013

2012

Measurements of True Leak Rates of MEMS Packages.

Bongtae Han

Sensors, 2012

Life prediction of LED-based recess downlight cooled by synthetic jet.

Bong-Min Song, Bongtae Han, Avram Bar-Cohen, Mehmet Arik, Rajdeep Sharma, Stan Weaver

Microelectron. Reliab., 2012

2010

Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages.

Changsoo Jang, Byeng Dong Youn, Ping F. Wang, Bongtae Han, Suk-Jin Ham

Microelectron. Reliab., 2010

2008

On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes.

Arindam Goswami, Bongtae Han

Microelectron. Reliab., 2008

2005

Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry.

Jinwon Joo, Seungmin Cho, Bongtae Han

Microelectron. Reliab., 2005