Bong Ho Kim

According to our database, Bong Ho Kim authored at least 5 papers between 2022 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

First Heterogeneous and Monolithic 3D (HM3D) Integration of InGaAs HEMTs and InP/InGaAs DHBTs on Si CMOS for Next-Generation Wireless Communication.

Nahyun Rheem, Jaeyong Jeong, Yoon-Je Suh, Chan Jik Lee, Bong Ho Kim, Joon Pyo Kim, Seong Kwang Kim, Hyeongrak Lim, Jongmin Kim, Dae-Hwan Ahn, Jae-Hoon Han, Jongwon Lee, Sanghyeon Kim

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023

Strategy for 3D Ferroelectric Transistor: Critical Surface Orientation Dependence of HfZrOx on Si.

Song-Hyeon Kuk, Jae-Hoon Han, Bong Ho Kim, Joon Pyo Kim, Sang-Hyeon Kim

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Cryogenic RF Transistors and Routing Circuits Based on 3D Stackable InGaAs HEMTs with Nb Superconductors for Large-Scale Quantum Signal Processing.

Jaeyong Jeong, Seong Kwang Kim, Yoon-Je Suh, Jisung Lee, Joonyoung Choi, Juhyuk Park, Joon Pyo Kim, Bong Ho Kim, Younjung Jo, Seung-Young Park, Jongmin Kim, Sanghyeon Kim

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Proposal of P-Channel FE NAND with High Drain Current and Feasible Disturbance for Next Generation 3D NAND.

Song-Hyeon Kuk, Jae-Hoon Han, Bong Ho Kim, Junpyo Kim, Sang-Hyeon Kim

Proceedings of the IEEE International Memory Workshop, 2023

2022

A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%).

Dae-Myeong Geum, Jinha Lim, Junho Jang, Seungyeop Ahn, SeongKwang Kim, Joonsup Shim, Bong Ho Kim, Juhyuk Park, Woo Jin Baek, Jaeyong Jeong, Sanghyeon Kim

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022