Bok Eng Cheah

According to our database, Bok Eng Cheah authored at least 2 papers between 2012 and 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2015

Study of dielectric material property impact on insertion loss for advanced packaging solutions.

Bok Eng Cheah, H. Louis Lo, Jackson Kong

Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2015

2012

Intrinsic capacitance extraction and estimation for system-on-chip power delivery development.

Li Chuang Quek, Bok Eng Cheah, Wai Ling Lee, Weng Chong Sam

Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems, 2012