Bob Chylak

According to our database, Bob Chylak authored at least 4 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.

Adeline B. Y. Lim, Wei Jian Neo, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2016

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.

Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2016

2014

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.

Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2014

2011

Nickel-palladium bond pads for copper wire bonding.

Horst Clauberg, Petra Backus, Bob Chylak

Microelectron. Reliab., 2011