Bo Zhang
Orcid: 0000-0002-4291-4543Affiliations:
- Shanghai Jiao Tong University, School of Mechanical Engineering, State Key Laboratory of Mechanical System and Vibration, China (PhD 2008)
According to our database1,
Bo Zhang
authored at least 12 papers
between 2009 and 2023.
Collaborative distances:
Collaborative distances:
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Bibliography
2023
Proceedings of the Intelligent Robotics and Applications - 16th International Conference, 2023
2022
IEEE Robotics Autom. Lett., 2022
A Robust Torque Controller Based on Link-side Damping Assignment for Flexible Joint Robots.
Proceedings of the International Conference on Advanced Robotics and Mechatronics , 2022
2020
Control of a Series Elastic Actuator Based on Sigmoid-Proportional-Retarded (SPR) with Online Gravity Compensation.
Proceedings of the Intelligent Robotics and Applications - 13th International Conference, 2020
2018
Control of a Mechanically Compliant Joint with Proportional-Integral-Retarded (PIR) Controller.
Proceedings of the Intelligent Robotics and Applications - 11th International Conference, 2018
2017
Control of a Magnet-Driven Nano Positioning Stage with Long Stroke Based on Disturbance Observer.
Proceedings of the Intelligent Robotics and Applications - 10th International Conference, 2017
2015
On a Novel Magnet-Driven Linear Actuator with Long Stroke and Nano-Positioning Accuracy.
Proceedings of the Intelligent Robotics and Applications - 8th International Conference, 2015
Design of a Levitating Nano-Positioning Stage with Arc-Edged Permanent Magnet Halbach Arrays.
Proceedings of the Intelligent Robotics and Applications - 8th International Conference, 2015
Calculation of the Magnetic Field of the Permanent Magnet Using Multi-domain Differential Quadrature.
Proceedings of the Intelligent Robotics and Applications - 8th International Conference, 2015
Frequency Analysis of the In-Plane Rotating Hub-Beam System Considering Effects of the Hub.
Proceedings of the Intelligent Robotics and Applications - 8th International Conference, 2015
2010
Modeling of board-level package by Finite Element Analysis and laser interferometer measurements.
Microelectron. Reliab., 2010
2009
Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact.
Microelectron. Reliab., 2009