Bo-In Noh

According to our database, Bo-In Noh authored at least 5 papers between 2008 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2014

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions.

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Microelectron. Reliab., 2014

2013

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test.

Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, Seung-Boo Jung

Microelectron. Reliab., 2013

2008

Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint.

Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung

Microelectron. Reliab., 2008

Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Microelectron. Reliab., 2008

Effect of surface finish material on printed circuit board for electrochemical migration.

Bo-In Noh, Jong-Bum Lee, Seung-Boo Jung

Microelectron. Reliab., 2008