Bjorn Vermeersch

Orcid: 0000-0001-8640-672X

According to our database1, Bjorn Vermeersch authored at least 18 papers between 2006 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5).
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.
IEEE Trans. Very Large Scale Integr. Syst., December, 2023

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Towards accurate temperature prediction in BEOL for reliability assessment (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
Thermal Performance Analysis of Mempool RISC-V Multicore SoC.
IEEE Trans. Very Large Scale Integr. Syst., 2022

Self-Heating in iN8-iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

III-V HBTs on 300 mm Si substrates using merged nano-ridges and its application in the study of impact of defects on DC and RF performance.
Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022

Impact of channel thickness scaling on the performance of GaN-on-Si RF HEMTs on highly C-doped GaN buffer.
Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022

2021
Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021

2017
almaBTE : A solver of the space-time dependent Boltzmann transport equation for phonons in structured materials.
Comput. Phys. Commun., 2017

2011
Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses.
Microelectron. Reliab., 2011

2009
Dynamic electrothermal simulation of integrated resistors at device level.
Microelectron. J., 2009

Dynamic thermal modelling of a power integrated circuit with the application of structure functions.
Microelectron. J., 2009

2008
Dependency of thermal spreading resistance on convective heat transfer coefficient.
Microelectron. Reliab., 2008

2007
Influence of thermal contact resistance on thermal impedance of microelectronic structures.
Microelectron. Reliab., 2007

Influence of substrate thickness on thermal impedance of microelectronic structures.
Microelectron. Reliab., 2007

2006
Thermal impedance plots of micro-scaled devices.
Microelectron. Reliab., 2006


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