Bjorn Vermeersch
Orcid: 0000-0001-8640-672X
According to our database1,
Bjorn Vermeersch
authored at least 18 papers
between 2006 and 2024.
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Bibliography
2024
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5).
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
Proceedings of the IEEE International Reliability Physics Symposium, 2024
2023
IEEE Trans. Very Large Scale Integr. Syst., December, 2023
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).
Proceedings of the IEEE International Reliability Physics Symposium, 2023
Towards accurate temperature prediction in BEOL for reliability assessment (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2023
2022
IEEE Trans. Very Large Scale Integr. Syst., 2022
Self-Heating in iN8-iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
III-V HBTs on 300 mm Si substrates using merged nano-ridges and its application in the study of impact of defects on DC and RF performance.
Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022
Impact of channel thickness scaling on the performance of GaN-on-Si RF HEMTs on highly C-doped GaN buffer.
Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022
2021
Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021
2017
almaBTE : A solver of the space-time dependent Boltzmann transport equation for phonons in structured materials.
Comput. Phys. Commun., 2017
2011
Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses.
Microelectron. Reliab., 2011
2009
Microelectron. J., 2009
Dynamic thermal modelling of a power integrated circuit with the application of structure functions.
Microelectron. J., 2009
2008
Microelectron. Reliab., 2008
2007
Influence of thermal contact resistance on thermal impedance of microelectronic structures.
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
2006