Bjoern Boehme

According to our database, Bjoern Boehme authored at least 3 papers between 2007 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling.

Viktor Dudash, Kashi Vishwanath Machani, Bjoern Boehme, Simone Capecchi, Jungtae Ok, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2008

Study of temperature dependent properties of organic substrate materials.

Bjoern Boehme, Klaus-Jürgen Wolter

Microelectron. Reliab., 2008

2007

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.

Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel

Microelectron. Reliab., 2007