Bioh Kim

According to our database, Bioh Kim authored at least 1 paper in 2009.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2009

Advanced wafer bonding solutions for TSV integration with thin wafers.

Bioh Kim, Thorsten Matthias, Markus Wimplinger, Paul Lindner

Proceedings of the IEEE International Conference on 3D System Integration, 2009