Bing Dang

According to our database, Bing Dang authored at least 14 papers between 2005 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Health Guardian: Using Multi-modal Data to Understand Individual Health.

Vince S. Siu, Kuan Yu Hsieh, Italo Buleje, Takashi Itoh, Tian Hao, Ben Civjan, Nigel Hinds, Bing Dang, Jeffrey L. Rogers, Bo Wen

Proceedings of the IEEE International Conference on Digital Health, 2023

A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring.

Italo Buleje, Vince S. Siu, Kuan Yu Hsieh, Nigel Hinds, Bing Dang, Erhan Bilal, Thanhnha Nguyen, Ellen E. Lee, Colin A. Depp, Jeffrey L. Rogers

Proceedings of the IEEE International Conference on Digital Health, 2023

2022

Health Guardian Platform: A technology stack to accelerate discovery in Digital Health research.

Bo Wen, Vince S. Siu, Italo Buleje, Kuan Yu Hsieh, Takashi Itoh, Lukas Zimmerli, Nigel Hinds, Elif Eyigöz, Bing Dang, Stefan von Cavallar, Jeffrey L. Rogers

Proceedings of the IEEE International Conference on Digital Health, 2022

2021

Development of a Smart Sleep Mask with Multiple Sensors.

Bing Dang, John Dicarlo, Stanislav Lukashov, Nigel Hinds, Jenna Reinen, Bo Wen, Tian Hao, Erhan Bilal, Jeff Rogers

Proceedings of the 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2021

2020

NOx Emission Flux Measurements with Multiple Mobile-DOAS Instruments in Beijing.

Yeyuan Huang, Ang Li, Pinhua Xie, Zhaokun Hu, Jin Xu, Xiaoyi Fang, Hongmei Ren, Xiaomei Li, Bing Dang

Remote. Sens., 2020

2015

An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors.

Kevin Tien, Noah Sturcken, Naigang Wang, Jae-Woong Nah, Bing Dang, Eugene J. O'Sullivan, Paul S. Andry, Michele Petracca, Luca P. Carloni, William J. Gallagher, Kenneth L. Shepard

Proceedings of the Symposium on VLSI Circuits, 2015

2012

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects.

Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman

IEEE J. Solid State Circuits, 2012

2008

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections.

Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker

IBM J. Res. Dev., 2008

Three-dimensional silicon integration.

John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright

IBM J. Res. Dev., 2008

3D chip stacking with C4 technology.

Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker

IBM J. Res. Dev., 2008

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.

Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer

IBM J. Res. Dev., 2008

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation.

Muhannad S. Bakir, Calvin King, Deepak C. Sekar, Hiren D. Thacker, Bing Dang, Gang Huang, Azad Naeemi, James D. Meindl

Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, 2008

2007

Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems.

Muhannad S. Bakir, Bing Dang, James D. Meindl

Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007

2005

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.

John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang

IBM J. Res. Dev., 2005