Bin-Bin Jia
Orcid: 0000-0003-3302-9398Affiliations:
- Lanzhou University of Technology, College of Electrical and Information Engineering, China
According to our database1,
Bin-Bin Jia
authored at least 17 papers
between 2019 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
Towards exploiting linear regression for multi-class/multi-label classification: an empirical analysis.
Int. J. Mach. Learn. Cybern., September, 2024
Wafer Map Defect Classification Using Autoencoder-Based Data Augmentation and Convolutional Neural Network.
CoRR, 2024
Proceedings of the Thirty-Third International Joint Conference on Artificial Intelligence, 2024
2023
Frontiers Comput. Sci., December, 2023
IEEE Trans. Pattern Anal. Mach. Intell., November, 2023
Multi-dimensional multi-label classification: Towards encompassing heterogeneous label spaces and multi-label annotations.
Pattern Recognit., June, 2023
IEEE Trans. Knowl. Data Eng., 2023
Proceedings of the Thirty-Second International Joint Conference on Artificial Intelligence, 2023
2022
IEEE Trans. Neural Networks Learn. Syst., 2022
IEEE Trans. Artif. Intell., 2022
Int. J. Autom. Comput., 2022
2021
Proceedings of the 38th International Conference on Machine Learning, 2021
2020
Pattern Recognit., 2020
Sci. China Inf. Sci., 2020
Combining One-vs-One Decomposition and Instance-Based Learning for Multi-Class Classification.
IEEE Access, 2020
Proceedings of the 25th International Conference on Pattern Recognition, 2020
2019
Proceedings of the Thirty-Third AAAI Conference on Artificial Intelligence, 2019