Bert Verlinden
According to our database1,
Bert Verlinden
authored at least 3 papers
between 2008 and 2012.
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Bibliography
2012
Diffusion growth of Cu<sub>3</sub>Sn phase in the bump and thin film Cu/Sn structures.
Microelectron. Reliab., 2012
2010
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.
Microelectron. Reliab., 2010
2008
Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures.
Microelectron. Reliab., 2008