Bernhard Wunderle

Orcid: 0000-0001-9675-4365

According to our database1, Bernhard Wunderle authored at least 20 papers between 2004 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Precise Adverse Weather Characterization by Deep-Learning-Based Noise Processing in Automotive LiDAR Sensors.
Remote. Sens., July, 2024

2023
Accelerated Real-Life (ARL) Testing and Characterization of Automotive LiDAR Sensors to facilitate the Development and Validation of Enhanced Sensor Models.
CoRR, 2023

Automotive LiDAR Based Precipitation State Estimation Using Physics Informed Spatio-Temporal 3D Convolutional Neural Networks (PIST-CNN).
Proceedings of the 29th International Conference on Mechatronics and Machine Vision in Practice, 2023

2022
Collaborative Filler Network for Enhancing the Performance of BaTiO3/PDMS Flexible Piezoelectric Polymer Composite Nanogenerators.
Sensors, 2022

2017
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy.
Microelectron. Reliab., 2017

Location resolved transient thermal analysis to investigate crack growth in solder joints.
Microelectron. Reliab., 2017

Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests.
Microelectron. Reliab., 2017

2016
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.
Microelectron. Reliab., 2016

Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

2014
Stress impact of moisture diffusion measured with the stress chip.
Microelectron. Reliab., 2014

2013
Transport of moisture at epoxy-SiO<sub>2</sub> interfaces investigated by molecular modeling.
Microelectron. Reliab., 2013

2012
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.
Microelectron. Reliab., 2012

Nanomechanics of CNTs for sensor application.
Proceedings of the International Multi-Conference on Systems, Signals & Devices, 2012

2011
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO<sub>2</sub> interface using molecular modelling.
Microelectron. Reliab., 2011

2010
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.
Microelectron. Reliab., 2010

2009
3-D thin chip integration technology - from technology development to application.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007
Reliability of SnPb and Pb-free flip-chips under different test conditions.
Microelectron. Reliab., 2007

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.
Microelectron. Reliab., 2007

2006
Progress in reliability research in the micro and nano region.
Microelectron. Reliab., 2006

2004
Parametric FE-approach to flip-chip reliability under various loading conditions.
Microelectron. Reliab., 2004


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