Bernhard Czerny

According to our database, Bernhard Czerny authored at least 8 papers between 2010 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl.

Bernhard Czerny, Golta Khatibi

Microelectron. Reliab., 2018

2017

Wire bond degradation under thermo- and pure mechanical loading.

Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2017

Reliability of Cu wire bonds in microelectronic packages.

Ali Mazloum-Nejadari, Golta Khatibi, Bernhard Czerny, Martin Lederer, Johann Nicolics, L. Weiss

Microelectron. Reliab., 2017

2016

Fatigue testing method for fine bond wires in an LQFP package.

Bernhard Czerny, Ali Mazloum-Nejadari, Golta Khatibi, Laurens Weiss, Michael Zehetbauer

Microelectron. Reliab., 2016

Interface reliability and lifetime prediction of heavy aluminum wire bonds.

Bernhard Czerny, Golta Khatibi

Microelectron. Reliab., 2016

2013

Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects.

Bernhard Czerny, I. Paul, Golta Khatibi, Markus Thoben

Microelectron. Reliab., 2013

2012

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions.

Bernhard Czerny, Martin Lederer, Bernhard Nagl, Alexander Trnka, Golta Khatibi, Markus Thoben

Microelectron. Reliab., 2012

2010

A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects.

Bernhard Czerny, Golta Khatibi, Brigitte Weiss, T. Licht

Microelectron. Reliab., 2010