Bernd Michel

According to our database, Bernd Michel authored at least 14 papers between 2001 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Stress analyses of high spatial resolution on TSV and BEoL structures.

Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2014

Stress impact of moisture diffusion measured with the stress chip.

Florian Schindler-Saefkow, Florian Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, Jürgen Keller

Microelectron. Reliab., 2014

On the crack and delamination risk optimization of a Si-interposer for LED packaging.

Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2014

2013

Effect of moisture swelling on MEMS packaging and integrated sensors.

J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2013

2012

Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.

O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle

Microelectron. Reliab., 2012

Studies on the reliability of power packages based on strength and fracture criteria.

Rainer Dudek, Reinhard Pufall, Bettina Seiler, Bernd Michel

Microelectron. Reliab., 2012

2011

Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO₂ interface using molecular modelling.

O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel

Microelectron. Reliab., 2011

2010

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.

Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl

Microelectron. Reliab., 2010

2009

Simulation based analysis of secondary effects on solder fatigue.

Rainer Dudek, Ralf Döring, Christine Bombach, Bernd Michel

Microelectron. Reliab., 2009

2007

Reliability of SnPb and Pb-free flip-chips under different test conditions.

M. Spraul, Wolfgang Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel

Microelectron. Reliab., 2007

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.

Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel

Microelectron. Reliab., 2007

2006

Progress in reliability research in the micro and nano region.

Bernhard Wunderle, Bernd Michel

Microelectron. Reliab., 2006

2004

Parametric FE-approach to flip-chip reliability under various loading conditions.

Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl

Microelectron. Reliab., 2004

2001

Mechanical Reliability of MEMS-structures under shock load.

Ulrich Wagner, J. Franz, M. Schweiker, Winfried Bernhard, Roland Müller-Fiedler, Bernd Michel, Oliver Paul

Microelectron. Reliab., 2001