Benjamin J. Fletcher

According to our database, Benjamin J. Fletcher authored at least 11 papers between 2017 and 2020.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2020

A Spike-Latency Transceiver With Tunable Pulse Control for Low-Energy Wireless 3-D Integration.

Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak

IEEE J. Solid State Circuits, 2020

A 3D-Stacked Cortex-M0 SoC with 20.3Gbps/mm² 7.1mW/mm² Simultaneous Wireless Inter-Tier Data and Power Transfer.

Benjamin J. Fletcher, Terrence S. T. Mak, Shidhartha Das

Proceedings of the IEEE Symposium on VLSI Circuits, 2020

2019

Design and Optimization of Inductive-Coupling Links for 3-D-ICs.

Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak

IEEE Trans. Very Large Scale Integr. Syst., 2019

Momentum: Power-neutral Performance Scaling with Intrinsic MPPT for Energy Harvesting Computing Systems.

Domenico Balsamo, Benjamin J. Fletcher, Alex S. Weddell, Giorgos Karatziolas, Bashir M. Al-Hashimi, Geoff V. Merrett

ACM Trans. Embed. Comput. Syst., 2019

A Low-Energy Inductive Transceiver using Spike-Latency Encoding for Wireless 3D Integration.

Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak

Proceedings of the 2019 IEEE/ACM International Symposium on Low Power Electronics and Design, 2019

A 10.8pJ/bit Pulse-Position Inductive Transceiver for Low-Energy Wireless 3D Integration.

Benjamin J. Fletcher, Terrence S. T. Mak, Shidhartha Das

Proceedings of the 45th IEEE European Solid State Circuits Conference, 2019

CoDAPT: A Concurrent Data And Power Transceiver for Fully Wireless 3D-ICs.

Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2019

2018

Globally Wireless Locally Wired (GloWiLoW): A Clock Distribution Network for Many-Core Systems.

Qian Ding, Benjamin J. Fletcher, Terrence S. T. Mak

Proceedings of the IEEE International Symposium on Circuits and Systems, 2018

Low-power 3D integration using inductive coupling links for neurotechnology applications.

Benjamin J. Fletcher, Shidhartha Das, Chi-Sang Poon, Terrence S. T. Mak

Proceedings of the 2018 Design, Automation & Test in Europe Conference & Exhibition, 2018

A high-speed design methodology for inductive coupling links in 3D-ICs.

Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak

Proceedings of the 2018 Design, Automation & Test in Europe Conference & Exhibition, 2018

2017

Power neutral performance scaling for energy harvesting MP-SoCs.

Benjamin J. Fletcher, Domenico Balsamo, Geoff V. Merrett

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2017