Benjamin Groven

Orcid: 0000-0002-5781-7594

According to our database1, Benjamin Groven authored at least 5 papers between 2017 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2024
EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023
Towards low damage and fab-compatible top-contacts in MX2 transistors using a combined synchronous pulse atomic layer etch and wet-chemical etch approach.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2021
On MX2-based metal-oxide-semiconductor device capacitance-voltage characteristics and dual-gate operation.
Proceedings of the Device Research Conference, 2021

2017
WS2 transistors on 300 mm wafers with BEOL compatibility.
Proceedings of the 47th European Solid-State Device Research Conference, 2017


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