Benjamin Groven
Orcid: 0000-0002-5781-7594
According to our database1,
Benjamin Groven
authored at least 5 papers
between 2017 and 2024.
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Bibliography
2024
EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
2023
Towards low damage and fab-compatible top-contacts in MX2 transistors using a combined synchronous pulse atomic layer etch and wet-chemical etch approach.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2021
On MX2-based metal-oxide-semiconductor device capacitance-voltage characteristics and dual-gate operation.
Proceedings of the Device Research Conference, 2021
2017
Proceedings of the 47th European Solid-State Device Research Conference, 2017